Thermophysical properties of SF6-Cu mixtures at temperatures of 300–30,000 K and pressures of 0.01–1.0 MPa: part 2. Collision integrals and transport coefficients

Xiaohua Wang, Linlin Zhong, Yann Cressault, Alain Gleizes, Mingzhe Rong

Abstract

The transport coefficients (including electrical conductivity, viscosity and thermal conductivity) of SF₆-Cu mixtures with copper proportions up to 50% are calculated as a function of temperature from 300 to 30,000 K and pressure from 0.01 to 1.0 MPa. The Lennard–Jones like phenomenological potential and some recently updated transport cross sections are adopted to obtain collision integrals. The influence of copper proportion and gas pressure on transport coefficients under various conditions are discussed in detail. Some results are tabulated for the modeling of SF₆ arc plasmas contaminated by Cu.